The push for smaller, faster computer chips faces a new hurdle as the semiconductor industry’s reliance on ultra-thin 2D materials for continued miniaturization comes under question.
But new research reveals a hidden atomic-scale gap that could limit how far these materials can take chip miniaturization, raising fresh concerns about the future of next-generation electronics.
Researchers at TU Wien have uncovered a hidden issue that could limit the usefulness of many widely studied 2D materials. Their findings show that the problem is not just about the material itself; it is about how it interacts with other layers inside a device.
“For many years, researchers have focused on the remarkable electronic properties of 2D materials like graphene or molybdenum disulfide,” says Prof. Mahdi Pourfath. “But a material alone does not make a working electronic device.”
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Modern computer chips rely on transistors, tiny switches that control the flow of electricity.
In these devices, a semiconductor carries current, and a gate electrode controls whether the current flows. Between them sits an insulating layer, usually an oxide, which plays a crucial role in the device’s operation.
To make chips smaller and more efficient, this insulating layer must be extremely thin. This allows better control over the electrical signals. However, when scientists examined how 2D materials interact with these insulating layers, they found something surprising.
“In many cases, the connection between the 2D material and the insulator is very weak,” explains Prof. Tibor Grasser. “They are held together only by van der Waals forces, which means they do not fully bond.”
This weak connection leads to a very small gap between the two layers. The gap measures only about 0.14 nanometers, far smaller than most structures scientists usually deal with.
To put it in perspective, a SARS-CoV-2 virus is roughly 700 times larger. Despite its tiny size, this gap has a major impact.
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The researchers found that the gap reduces the strength of the electrical interaction between the layers. This weakens what scientists call ‘capacitive coupling,’ which is essential for controlling the transistor. Even if the 2D material itself performs very well, this gap can limit the overall device performance.
“As long as this gap exists, it sets a fundamental limit on how small these devices can become,” says Grasser.
This means that some of the most promising 2D materials may not be suitable for future chip technologies after all. The issue has been largely overlooked, as much of the research so far has focused only on the properties of the materials in isolation.
The findings carry serious implications for the semiconductor industry. Companies around the world are investing in next-generation materials to keep up with the growing demand for faster, more efficient electronics. If certain materials cannot overcome this limitation, those investments could face significant risks.
“If the semiconductor industry wants to succeed with 2D materials, it must design the semiconductor and the insulating layer together from the start,” says Pourfath.
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One promising solution is what researchers call ‘zipper materials.’ These materials are designed so that the semiconductor and the insulator fit together more tightly. Instead of being loosely connected, they form stronger bonds that remove the gap entirely.
This approach could help maintain strong electrical performance even at extremely small scales. It also gives scientists a clearer way to identify which materials are worth pursuing and which ones may not work in practical devices.
“Our work brings good news,” says Grasser. “We can now predict which materials are suitable for future miniaturization and which are not.”
The discovery highlights an important lesson for the future of chip design. It is no longer enough to look at materials in isolation. The interfaces between them, the tiny spaces where different layers meet, can determine success or failure.
As the semiconductor industry pushes toward ever-smaller technologies, even the smallest details matter. In this case, a gap smaller than an atom could shape the future of computing.
