
Cornell Researchers Find ‘Mouse Bite’ Defects in Semiconductors With 3D Imaging
Cornell University researchers used high-resolution 3D imaging to detect atomic-scale “mouse bite” defects inside computer chips for the first time. Working with TSMC and ASM, the team captured images of transistor channels just 15 to 18 atoms wide. The breakthrough helps chipmakers spot manufacturing flaws during development and could improve everything from phones to quantum computers.














