Samsung Electronics and Broadcom have signed a memorandum of understanding (MOU) to strengthen their partnership in AI chip development across memory and foundry technologies.
The collaboration is expected to exceed $200 billion over the next five years through 2030. Both companies aim to support the rapid growth of artificial intelligence infrastructure with advanced semiconductor solutions.
The agreement was announced during the AI Summit held at The Midway in San Francisco. Senior executives from both companies attended the event alongside representatives from the South Korean government. Samsung Foundry President Jinman Han and Broadcom President and CEO Hock Tan were among the key participants.
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Memory Supply Focus
A major part of the partnership centres on advanced memory technologies used in AI systems. Samsung will work with Broadcom to supply High Bandwidth Memory (HBM), a specialised type of memory designed to move large amounts of data at high speed. These memory chips play a major role in AI accelerators, which process complex AI workloads much faster than traditional processors.
Demand for HBM has increased sharply as AI models continue to grow in size and complexity. Faster memory allows AI systems to handle larger datasets while reducing processing delays. By securing long-term memory supplies, Broadcom aims to strengthen its future AI hardware portfolio.
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Advanced AI Chip Manufacturing
The companies are also expanding cooperation in semiconductor manufacturing through Samsung’s foundry business.
The collaboration includes Samsung’s 2-nanometre manufacturing process and future technologies smaller than 2nm for Broadcom’s products, including Wireless Broadband Communications solutions. Smaller manufacturing processes allow more transistors to fit onto a chip, improving performance while lowering power consumption.
The agreement also covers advanced packaging technologies based on Samsung’s 2nm process. These include 2.3D and 2.5D integration methods that place multiple chips closer together to improve communication speed and overall efficiency. Such packaging techniques have become increasingly important as AI processors demand higher computing power without significantly increasing energy use.
Broadcom Deepens AI Chip Ties
Samsung said the expanded partnership reflects the industry’s growing need for tightly connected semiconductor technologies.
Young Hyun Jun, Vice Chairman and CEO of Samsung Electronics’ Device Solutions Division, said AI is creating strong demand for integrated solutions covering memory, logic chips and advanced packaging. He added that closer collaboration with Broadcom will help deliver greater value to customers while supporting future AI infrastructure.
Broadcom also highlighted the importance of stronger cooperation across the semiconductor industry.
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Charlie Kawwas, President of Broadcom’s Semiconductor Solutions Group, said combining Samsung’s manufacturing capabilities with Broadcom’s expertise in AI and connectivity will support technologies needed for the next generation of AI infrastructure. He said closer partnerships are becoming increasingly important as AI systems continue to expand.
Industry Impact Ahead
Samsung remains one of the few companies that operates across memory manufacturing, chip design support, foundry production, and advanced packaging. This broad portfolio allows it to provide customers with multiple semiconductor services under one ecosystem. The partnership with Broadcom strengthens that position as technology companies seek reliable suppliers for complex AI hardware.
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The agreement also reflects wider changes across the global semiconductor industry as companies invest heavily to meet rising AI demand. Long-term partnerships between chip designers and manufacturers are becoming more common to secure supply chains and accelerate product development.
However, collaborations like this are expected to shape the next generation of high-performance computing infrastructure.
